Реферат: Пайка неметаллов и ферритов (русс+англ)

             Донской Государственный Технический Университет             
            Кафедра: УМашины и Автоматизация Сварочного ПроизводстваФ            
        лОсобенности пайки неметаллических материалов и ферритов        
Выполнил студент группы
Проверил
                                г. Ростов-на-Дону                                
                                     2003 г.                                     
                              Contents/ Содержание                              
     I Introduction. 3
     II Soldering of semiconductors. 4
     III Soldering of graphite. 7
     The soldering of graphite with steels. 9
     The soldering of graphite with copper 11
     The soldering of graphite with graphite. 12
     IV The soldering of glasses with metals. 13
     I Введение. 17
     II Пайка полупроводников. 18
     III Пайка графита. 21
     Пайка графита со сталями. 23
     Пайка графита с медью.. 24
     Пайка графита с графитом. 25
     IV Пайка стекла и металлов. 26
     
I Introduction
In the given work features of the soldering of metals with nonmetallic
materials, namely the soldering of semiconductors, the soldering of graphite
with metals are considered, the soldering flew down with metals.
The soldering of semiconductors use as at internal installation of devices -
the soldering current supply, the soldering of transition on crystal owner,
and at external installation - the soldering of external conclusions,
hermetic sealing.
Connection of graphite with metals is caused by economic reasons, and also
necessity of realization of positive properties of graphite. Examples of such
designs are lengthy heaters, crucibles and pumps for smelting of metals,
electrodes of arc furnaces, large-sized anodes of mercury rectifiers, heaters
of mine furnaces, high-temperature  heat exchanger, heater elements, etc.
The soldering of metal with glass apply at creation of a different sort of
vacuum devices (floodgates, observation ports, etc.), at manufacturing lamps
(from tiny up to powerful generating), in manufacture of large mirrors of
optical devices, for facing an internal part of pipes of oil pipelines, etc.
The fused glasses well moisten all metals under condition of presence on
their surface of an adsorbing layer of oxide and heating to the corresponding
temperature. Formation of strong connection between metal and glass depends
on pressure in a zone of junction, presence of gas bubbles, process
electrolysis and расстекловывания glasses.
     
II Soldering of semiconductors
A surface of a product from the semiconductor, subject to the soldering,
preliminary cover by tin in melt solder with the help of a ultrasonic
soldering iron, way of a galvanic covering (nickel plating, gilding).
The soldering make in furnaces with a controllable atmosphere (neutral,
regenerative), in vacuum or a method of resistance preliminary covered by tin
surfaces. At connection of products with available transition it is required
to maintain strictly temperature of heating to what apply temperature
regulators.
The soldering of thin electric conclusions can be carried out on air
microsoldering irons with use of protective or active gumboil (alcohol a
solution of rosin, a gumboil on the basis of chloride ammonium). After the
gumboil soldering a product wash out deionized water and dry.
In manufacture of semiconductors of operation on assembly of a product under
the soldering carry out in the assembly rulers having a controllable
atmosphere and consisting of several survival suits connected among
themselves in which air or nitrogen of the certain temperature and humidity
moves.
At the soldering of semi-conductor materials solders should form electro-hole
transition or not straightening ohmic contact. In manufacture germanium and
silicon devices as a basis apply aluminium, indium and alloys on the basis of
tin and lead. For creation in a place of contact of conductivity of
electronic type in a basis of solders as impurity enter phosphorus, arsenic,
antimony and bismuth. For maintenance of not straightening ohmic contact in a
basis of solders add a bor and gallium.
At creation of transitions and ohmic contacts on intermetallic connections
apply tin, bismuth, antimony, zinc, cadmium, etc.
Structures of solders and modes of the soldering germanium and silicon are
resulted in tab. 1. To the soldering of semiconductors apply also solders -
pastes on the basis of gallium. For maintenance of reliability of wetting of
a contact surface use ultrasound.
                                                                         Table 1
  Compositions of the solders and modes of the soldering germanium and silicon  
     
Soldered material
Composition solder (mass shares), %
Modes of the soldering
Using, particularities of the process
Temperature,  С
Time, mines.
Ambience
Silicon n-type
Pb   Ц 63;
Sn   Ц 35,5;
Sb   Ц 1,5
720÷730
12÷13
Gumboil
Pb   Ц 97;
Sb   Ц 1,5;
Ni   Ц 1,5
Aluminum
___
___
Vacuum 6*10-2   Pa
Silicon valves
Silumin
Ag   Ц 97;
Pb   Ц 2; Sb - 1
Silicon
Gold (contact-reactive soldering)
420
___
___
Integral schemes
Arsenide gallium + +nickel and silicon + +nickel
Ga   Ц 39,6;
Sn   Ц 4,4;
Cu   (powder) -56
100
Heating by ray of the lazer
Silicon KEF + ковар 29НК
Glass S48 - 1 or "Pireks"
980
10
Argon
Soldering in two stages:
1) glass with коваром;
2)glass-коваровый node with silicon             U = 800÷1000В
400÷450
20÷25
Germanium + platinum
Sn   Ц 99; Bi - 1
280
5
Hydrogen
___
The structure of solders influences electric parameters soldering devices,
therefore at a choice of solders it is necessary to take into account their
physical properties, for example conduction, temperature factor of linear
expansion.
Structure of the solders used for low-temperature of the soldering of
semiconductors, are resulted in tab. 2.
                                                                         Table 2
Compositions низкотемпературных solders applicable when soldering germanium
and silicon
     
Contents (mass shares),   %
Тmelt,